Name High temperature resistant circuit board transplanting adhesive(THO4059) Outline It is double-component epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well, Applications It is applicable to the self-bonding and mutual-bonding of metals, the ceramics, the composite materials (PCB) materials working under the hot conditions. It also applies to the bonding, sealing repairing and high temperature reflowing of electrical heating parts and components. Features The A component is the tinted thick liquid, non-solid particle. The B component is in tinted paste shape. Fast curing velocity. At 212 °F, during 0.45-1 hour, it is at the early stage of curing,, it reaches its maximum bonding strength when cooling down. Being durable and resistant to ultraviolet light, once the bond has formed. Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature.
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