GLPOLY The thermal gel XK-G60 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and thermally conductive properties. XK-G60 is formulated to accommodate today’s high performance electronics requirements and designed to transfer a high degree of heat away from hot components to heat sink. Chomerics THERM-A-GEL 60
It is a fully cured, no pump out, auto dispensable thermal interface material designed to replace conventional thermal conductive gap filler or pad. Simply dispense thermal gel onto component, assemble heat sink over it, and the product is ready to go. It is ideal for rework and maintainment situation. This thermal gel does not require mixing and cure cycle, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible. Chomerics THERM-A-GEL 60
With ultra soft properties, this thermal gel can easily deflect under very low forces.
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